17.Dielectrics and Electrical Insulation by John G. Webster (Editor)

By John G. Webster (Editor)

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In most cases, the increase in the reactive energy density and the operating voltage can be traced to advancements in both the dielectric fluids and the metallization. Polymeric Packaging and Encapsulation. Injection molding technology has been developed that can produce a capacitor case and cover with a built-in pressure interrupter. These cases and covers are leak-tight and can withstand high fault pressure. These new chemistries provide superior humidity resistance, improved dielectric strength and can be applied with a much faster process which translates into lower cost.

PPS is a very low loss and temperature-stable dielectric which offers size reduction compared to zero temperature coefficient ceramic chips. 5 Ȑm thickness for over 10 years. 6 Ȑm in development) that is allowing another expansion of MLP capacitor capacitance-voltage products. PET was selected because of its good electrical characteristics, excellent reliability, and ready availability. 35 Ȑm thickness. PEN film, a virtual clone of PET, has increased thermal resistance for surface mount applications and very good hightemperature electrical stability.

Cathode plate connected in the tantalum capacitor package to an external contact via a coating of carbon and then silver as a final coat. not make any sense to build smaller case sizes with smaller capacitances, because capacitance is a secondary consideration in this application. ESR is the primary concern. These devices are all life tested and surge tested. They have been put on extended surge testing from 0 Vdc to rated Vdc and back through millions of pulses with no failures. Extended ac current testing has shown that the heat buildup within the part is proportional to the ESR, and because the ESR is so much lower, there is little additional heat developed internally.

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